R. Tilgner

On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part I: Metallization

M. Stecher, P. Alpern, H. Gunther, 2009, IEEE Transactions on Device and Materials Reliability.

Evaluation of the impact of mechanical stress on CMOS device mismatch

R. Schmidt, U. Kollmer, Carsten Linnenbank, 2001, ICMTS 2001. Proceedings of the 2001 International Conference on Microelectronic Test Structures (Cat. No.01CH37153).

A simple test chip to assess chip and package design in the case of plastic assembling

R. Tilgner, P. Alpern, V. Wicher, 1994 .

Photoacoustic Effect: Principles And Applications

R. Tilgner, E. Lüscher, Peter Korpiun, 1984 .

On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part III: Chip Coating, Passivation, and Design

M. Stecher, P. Alpern, H. Gunther, 2009, IEEE Transactions on Device and Materials Reliability.

IR microscopic observation of plastic encapsulated TAB inner lead bonds degrading during thermal cycling

R. Tilgner, P. Alpern, 1990, 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium.

Investigations on popcorn cracking of T-QFP packages

Bernd Michel, Rainer Dudek, C. Birzer, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).