J. Oakley

Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability

Fen Chen, J. Liu, Subramanian S. Iyer, 2015, 2015 IEEE International Reliability Physics Symposium.

Through silicon via (TSV) effects on devices in close proximity - the role of mobile ion penetration - characterization and mitigation

J. Safran, J. Liu, J. Golz, 2014, 2014 IEEE International Electron Devices Meeting.