Joachim Kloeser

New Material Deposition Technologies for Advanced Packaging

Paul Kasulke, Joachim Kloeser, Ekra Eduard Krafi, 2003 .

Document with a chip and method for producing a document

Joachim Kloeser, Olaf Dressel, Oliver Muth, 2010 .

Low cost bumping by stencil printing: process qualification for 200 μm pitch

Andreas Ostmann, Herbert Reichl, Joachim Kloeser, 1998 .

Bump formation for flip chip and CSP by solder paste printing

Herbert Reichl, Joachim Kloeser, Rolf Aschenbrenner, 2002, Microelectron. Reliab..

Semifinished product for producing a chip card module, method for manufacturing the semi-finished product and to methods of manufacturing a smart card

Joachim Kloeser, Alexander Ferber, Denis Donath, 2011 .

Lead free solders for area array packaging

H. Reichl, R. Aschenbrenner, Joachim Kloeser, 2000 .

Future high security ID documents based on innovative microsystem technologies

Manfred Paeschke, Joachim Kloeser, Jorg Fischer, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Method and apparatus for producing a value and / or security document with an antenna structure

Joachim Kloeser, Oliver Muth, Alexander Ferber, 2012 .

A low cost bumping process for flip chip and CSP applications

Andreas Ostmann, H. Reichl, Joachim Kloeser, 1999 .

Flip chip contacts for high current conducting assemblies

Herbert Reichl, R. Aschenbrenner, Joachim Kloeser, 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).

Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects

Herbert Reichl, Bernd Michel, Rainer Dudek, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates

Herbert Reichl, Joachim Kloeser, E. Zakel, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Fluxless flip-chip attachment techniques using the Au/Sn metallurgy

Herbert Reichl, Elke Zakel, Christine Kallmayer, 1995, Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'.

Alternative solders for flip chip applications in the automotive environment

Herbert Reichl, R. Aschenbrenner, Joachim Kloeser, 1998, Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

Andreas Ostmann, H. Reichl, Elke Zakel, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.