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Innovation of 300 mm fab manufacturing with single wafer technology

Y. Sasaki, S. Ikeda, K. Nemoto, 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

Process integration of single-wafer technology in a 300-mm fab, realizing drastic cycle time reduction with high yield and excellent reliability

Y. Sasaki, Michimasa Funabashi, K. Nemoto, 2003 .