X. R. Zhang

Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system

John H. L. Pang, X. Q. Shi, X. R. Zhang, 2004, Microelectron. Reliab..

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

X. R. Zhang, Xiaowu Zhang, Shan Gao, 2011 .

The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

X. R. Zhang, Xiaowu Zhang, F. Che, 2010 .

Determination of interface fracture toughness of adhesive joint subjected to mixed-mode loading using finite element method

John H. L. Pang, X. R. Zhang, J. Pang, 2006 .

Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens

H.L.J. Pang, X. R. Zhang, X. Shi, 2002 .