M. Tentzeris

Adaptive Modeling of Complex Packaging Geometries Using Haar-based MRTD Algorithms

B. McGarvey, D. Staiculescu, M. Tentzeris, 2000, 2000 30th European Microwave Conference.

Coupling of Solid-State and Electromagnetic Equations for Simulation of Wireless Packaged Geometries

B. McGarvey, M. Tentzeris, 2001, 2001 31st European Microwave Conference.

A highly integrated 3D millimeter-wave filter using LTCC system-on-package (SOP) technology for V-band WLAN gigabit wireless systems

M. Tentzeris, J. Papapolymerou, J. Laskar, 2005, 2005 Asia-Pacific Microwave Conference Proceedings.

RF System-on-Package (SOP) Development for compact low cost Wireless Front-end systems

M. Tentzeris, M. Maeng, S. Pinel, 2002, 2002 32nd European Microwave Conference.

Comparison of electromagnetic solvers for the analysis of LTCC components

M. Tentzeris, T. Rozzi, P. Russer, 2003, IEEE Antennas and Propagation Society International Symposium. Digest. Held in conjunction with: USNC/CNC/URSI North American Radio Sci. Meeting (Cat. No.03CH37450).

System-on-Package (SOP) Architectures for compact and low cost RF Front-end modules

M. Tentzeris, M. Maeng, S. Pinel, 2003, 2003 33rd European Microwave Conference, 2003.

Next Generation Packaging Architectures for Highly Integrated Wireless Systems

M. Tentzeris, J. Laskar, A. Sutono, 2000, 2000 30th European Microwave Conference.