C. Merckling
发表
P. Wambacq,
B. Parvais,
A. Vandooren,
2017,
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
Cor Claeys,
Eddy Simoen,
C. Merckling,
2013,
IEEE Transactions on Device and Materials Reliability.
C. Merckling,
M. Gendry,
Y. Rozier,
2007,
Microelectron. Reliab..
C. Merckling,
N. Waldron,
N. Collaert,
2016,
2016 IEEE Symposium on VLSI Technology.
C. Merckling,
D. Lin,
A. Alian,
2012,
IEEE Electron Device Letters.
Michel Gendry,
C. Merckling,
Vincent Favre-Nicolin,
2007
.
Silicon−Molecules−Metal Junctions by Transfer Printing: Chemical Synthesis and Electrical Properties
C. Merckling,
Dominique Vuillaume,
Xavier Wallart,
2007
.
R. Degraeve,
C. Merckling,
Dennis Lin,
2012,
IEEE Electron Device Letters.
C. Merckling,
D. Lin,
N. Waldron,
2014,
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.
B. Kaczer,
G. Hellings,
L. Witters,
2012,
2012 IEEE International Reliability Physics Symposium (IRPS).
A. Vais,
C. Merckling,
N. Waldron,
2015,
2015 IEEE International Electron Devices Meeting (IEDM).