Adren Hsieh

Synergy between 2.5/3D development and hybrid 3D Wafer Level Fanout

John Hunt, Y. C. Ding, Adren Hsieh, 2012, 2012 4th Electronic System-Integration Technology Conference.

Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements

John Hunt, Adren Hsieh, Eddie Tsai, 2014 .

Chip Last Fan Out as an Alternative to Chip First

Scott Chen, John Hunt, Simon Wang, 2015 .