Hou-Jun Hsu

Development ofCMOS Process Compatible Force Sensor anditsApplication toProbeCard

Jung-Tang Huang, Ming-Chieh Chiu, Chan-Shoue Wu, 2007 .

Analysis and design of MEMS RF probe

Chia-Hung Chou, Jung-Tang Huang, Hou-Jun Hsu, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Singular Uniformity after Reflow of Varied-Shaped Flip Chip Solder Bump on Single Substrate

Jung-Tang Huang, Sheng-Hsiung Shih, Chan-Shoue Wu, 2006, 2006 International Conference on Electronic Materials and Packaging.

Development of UV-LIGA contact probe

Jung-Tang Huang, Hou-Jun Hsu, Kuo-Yu Lee, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Fabrication of a MEMS-Based Cobra Probe

Jung-Tang Huang, Sheng-Hsiung Shih, Chan-Shoue Wu, 2007, 2007 IEEE Conference on Electron Devices and Solid-State Circuits.

A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

Jung-Tang Huang, Sheng-Hsiung Shih, Hou-Jun Hsu, 2007 .

Fabrication on uniform plating-based flip chip solder bumps after reflow process using a polishing mechanism

Jung-Tang Huang, Sheng-Hsiung Shih, Hou-Jun Hsu, 2007 .