Pen-Shan Chao

Development ofCMOS Process Compatible Force Sensor anditsApplication toProbeCard

Jung-Tang Huang, Ming-Chieh Chiu, Chan-Shoue Wu, 2007 .

Singular Uniformity after Reflow of Varied-Shaped Flip Chip Solder Bump on Single Substrate

Jung-Tang Huang, Sheng-Hsiung Shih, Chan-Shoue Wu, 2006, 2006 International Conference on Electronic Materials and Packaging.

Fabrication of a MEMS-Based Cobra Probe

Jung-Tang Huang, Sheng-Hsiung Shih, Chan-Shoue Wu, 2007, 2007 IEEE Conference on Electron Devices and Solid-State Circuits.

High density vertical probe card fabrication with low cost and high precision characteristics by using MEMS process

Chung-Yi Lin, Jung-Tang Huang, Sheng-Hsiung Shih, 2005, 2005 7th Electronic Packaging Technology Conference.

A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

Jung-Tang Huang, Sheng-Hsiung Shih, Hou-Jun Hsu, 2007 .

Fabrication on uniform plating-based flip chip solder bumps after reflow process using a polishing mechanism

Jung-Tang Huang, Sheng-Hsiung Shih, Hou-Jun Hsu, 2007 .