Toshiaki Morita

2311 A case study on designing esthetically and making prototypes for IT appliances : Challenge of Sapporo IT Carrozzeria Project

Yoshiyuki Shiroma, Shoichi Hosoda, Yasuaki Ohshima, 2005 .

Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties

Yoshio Kobayashi, Toshiaki Morita, Yoshio Kobayashi, 2011 .

Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior

Takuto Yamaguchi, Akio Hirose, Eiichi Ide, 2008 .

Optimal design of coating material for nanoparticles and its application for low-temperature interconnection

Yusuke Yasuda, Eiichi Ide, Jiro Ushio, 2010 .

Study of Bonding Technology Using Silver Nanoparticles

Kojiro F. Kobayashi, Akio Hirose, Yusuke Yasuda, 2008 .

Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles

Akio Hirose, Yusuke Yasuda, Eiichi Ide, 2008 .

Improvement of power cycling reliability of 3.3kV full-SiC power modules with sintered copper technology for Tj, max=175°C

Daisuke Kawase, Masakazu Sagawa, Takashi Ishigaki, 2018, 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

Microstructure of metallic copper nanoparticles/metallic disc interface in metal–metal bonding using them

Yoshio Kobayashi, Takafumi Maeda, Yusuke Yasuda, 2013 .

Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution

Yoshio Kobayashi, Toshiaki Morita, Yoshio Kobayashi, 2012 .