Masao Segawa

Flip chip interconnection method applied to small camera module

Jun Karasawa, Masao Segawa, Y. Kishimoto, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package

Masao Segawa, Kazuki Tateyama, Yasunari Ukita, 2005 .