Sung Ki Cho

Bottom-up Filling of TSV-Scaled Trenches by Using Step Current Electrodeposition

Yoonjae Lee, Myung Jun Kim, Jae Jeong Kim, 2015 .

Effect of cathode material on the electrorefining of U in LiCl-KCl molten salts

Do-Hee Ahn, Sung Ki Cho, Tack-Jin Kim, 2017 .

Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler

Young Gyu Kim, Sung Ki Cho, Jung Hwan Oh, 2017 .

Electrodeposition of crystalline and photoactive silicon directly from silicon dioxide nanoparticles in molten CaCl2.

Sung Ki Cho, A. Bard, F. Fan, 2012, Angewandte Chemie.