R. J. Kamaladasa

Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress

Timothy McMullen, M. Harmes, I. Tsamaret, 2015, 2015 IEEE International Reliability Physics Symposium.

Mechanism of localized electrical conduction at the onset of electroforming in TiO2 based resistive switching devices

James A. Bain, Marek Skowronski, Paul A. Salvador, 2014 .

Local heating-induced plastic deformation in resistive switching devices

James A. Bain, Marek Skowronski, Paul A. Salvador, 2011 .

Site-specific comparisons of V-defects and threading dislocations in InGaN/GaN multi-quantum-wells grown on SiC and GaN substrates

Fang Liu, Robert F. Davis, Edward A. Preble, 2014 .

Microstructure of epitaxial GaN films grown on chemomechanically polished GaN(0001) substrates

Fang Liu, Robert F. Davis, Edward A. Preble, 2012 .