P. Alpern
发表
Rainer Dudek,
Rainer Tilgner,
Kheng Chooi Lee,
2002
.
R. Tilgner,
P. Alpern,
V. Wicher,
1994
.
Correction to "A Simple Test Chip to Assess Chip and Package Design in the Case of Plastic Assemblin
P. Alpern,
V. Wicher,
A. R. Tilgner,
1995
.
P. Alpern,
K. C. Lee,
D. Lee,
2012,
2012 IEEE International Reliability Physics Symposium (IRPS).
R. Tilgner,
P. Alpern,
1990,
8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium.
M. Stecher,
J. Wilde,
T. Smorodin,
2007,
2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.
M. Stecher,
J. Wilde,
T. Smorodin,
2008,
IEEE Transactions on Device and Materials Reliability.
Rainer Dudek,
Rainer Tilgner,
P. Alpern,
2002
.
Bernd Michel,
Rainer Dudek,
C. Birzer,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
Ronald Kakoschke,
P. Alpern,
Stefan Dipl.-Phys. Wurm,
1988
.
Rainer Tilgner,
P. Alpern,
R. Schmidt,
2005
.
Rainer Dudek,
Rainer Tilgner,
P. Alpern,
2000
.