A. Vass-Varnai

Package Characterization: Simulations or Measurements?

M. Rencz, A. Poppe, A. Vass-Varnai, 2008, 2008 10th Electronics Packaging Technology Conference.

A detailed IC package numerical model calibration methodology

R. Bornoff, A. Vass-Varnai, 2013, 29th IEEE Semiconductor Thermal Measurement and Management Symposium.