D. Dornfeld

Chapter 1.2. Fundamentals: Principles of Sensors in Manufacturing

D. Dornfeld, 2008 .

Trends in the environmental impacts of CMOS manufacturing

D. Dornfeld, S.B. Boyd, N. Krishnan, 2008, 2008 IEEE International Symposium on Electronics and the Environment.

UC Berkeley Green Manufacturing and Sustainable Manufacturing Partnership Title Quantifying the Environmental Footprint of Semiconductor Equipment Using the Environmental Value Systems Analysis ( EnV-S ) Permalink

D. Dornfeld, N. Krishnan, S. Raoux, 2004 .

Development of a CMP pad with controlled micro features for improved performance

Sunghoon Lee, D. Dornfeld, Hyoungjae Kim, 2005, ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005..

Environmental Challenges for 45-nm and 32-nm node CMOS Logic

D. Dornfeld, S. Boyd, N. Krishnan, 2007, Proceedings of the 2007 IEEE International Symposium on Electronics and the Environment.

Using a hybrid approach to evaluate semiconductor life cycle environmental issues - a case study in interconnect module impacts

D. Dornfeld, S. Boyd, S. Raoux, 2004, IEEE International Symposium on Electronics and the Environment, 2004. Conference Record. 2004.

Life Cycle Inventory of a CMOS Chip

Stephen P. Boyd, D. Dornfeld, S. Boyd, 2006, Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006..

Energy Use in Nanoscale Manufacturing

Stephen P. Boyd, D. Dornfeld, T.W. Zhang, 2006, Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006..