A. D. Trigg

Modular sensor chip design for package stress evaluation and reliability characterisation

Xiaowu Zhang, Tai Chong Chai, Leong Ching Wai, 2012, Microelectron. Reliab..

Design and fabrication of silicon hybrid multi-chip modules

A. D. Trigg, 1989 .

Dry etching of AlxGa1-xN/GaN by CCl2F2 chemistry for device isolation

B. P. Singh, S. Gunawan, A. D. Trigg, 2005 .

WSiN cap for Ohmic contacts to n-GaN with better morphology

B. P. Singh, S. Gunawan, A. D. Trigg, 2005 .