Haoyang Chen

Development of low-cost wafer level package through integrated design and simulation analysis

Jong Heon Kim, In Soo Kang, Teck Kheng Lee, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Prototyping of low-cost wafer level packages

Jong Heon Kim, In Soo Kang, Teck Kheng Lee, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Electrical simulation and measurement of IPD with multilayer thin film technology for WLP

Glen Siew, Serine Soh, Tong Yan Tee, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.