Bok Leng Ser

Development of low-cost wafer level package through integrated design and simulation analysis

Jong Heon Kim, In Soo Kang, Teck Kheng Lee, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Prototyping of low-cost wafer level packages

Jong Heon Kim, In Soo Kang, Teck Kheng Lee, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Trace-in-bump for flip chip applications

Bok Leng Ser, T. Lee, Amit Kumar, 2017, 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).