Donald W. Henderson

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

Da-Yuan Shih, Karl J. Puttlitz, Sung K. Kang, 2005, IBM J. Res. Dev..

Recent Progress on Pb-free Electronics in IBM

Da-Yuan Shih, Marie S. Cole, Peter A. Gruber, 2006 .

Simulation of structural anisotropy and void formation in amorphous thin films

D. W. Henderson, Praveen Chaudhari, Donald W. Henderson, 1974 .

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

Paul A. Lauro, Da-Yuan Shih, Minhua Lu, 2008 .

Thermal analysis of non-isothermal crystallization kinetics in glass forming liquids

D. W. Henderson, Donald W. Henderson, 1979 .

Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

Jin Yu, Won Kyoung Choi, Da-Yuan Shih, 2004 .

Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

Jin Yu, Da-Yuan Shih, Sung K. Kang, 2006 .

Interfacial reaction studies on lead (Pb)-free solder alloys

Paul A. Lauro, Da-Yuan Shih, Karl J. Puttlitz, 2001, ECTC 2001.

Controlling Cu electroplating to prevent sporadic voiding in Cu3Sn

Peter Borgesen, Liang Yin, Nikolay Dimitrov, 2009, 2009 59th Electronic Components and Technology Conference.

Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy composition

Da-Yuan Shih, D. W. Henderson, Donald W. Henderson, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..