David Soon Wee Ho

Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package

Zhaohui Chen, Tai Chong Chai, Faxing Che, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Drop impact reliability study of high density fan-out wafer level package

Zhaohui Chen, Vempati Srinivasa Rao, Tai Chong Chai, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Development of low profile fan out PoP solution with embedded passive

Han Yong, Zhaohui Chen, Chai Tai Chong, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Process and reliability assessment of 200μm-thin embedded wafer level packages (EMWLPs)

Srinivasa Rao Vempati, Chee Houe Khong, Ser Choong Chong, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).