Yasuhiro Take

发表

Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs

Tadahiro Kuroda, Hideharu Amano, Hiroki Matsutani, 2013, IEICE Trans. Inf. Syst..

Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces

Tadahiro Kuroda, Hideharu Amano, Hiroki Matsutani, 2016, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card

Tadahiro Kuroda, Hiroki Ishikuro, Noriyuki Miura, 2012, IEEE Journal of Solid-State Circuits.

A 2.7Gb/s/mm2 0.9pJ/b/chip 1coil/channel ThruChip interface with coupled-resonator-based CDR for NAND Flash memory stacking

Tadahiro Kuroda, Noriyuki Miura, Yasuhiro Take, 2011, 2011 IEEE International Solid-State Circuits Conference.

Demonstration of a heterogeneous multi-core processor with 3-D inductive coupling links

Hiroshi Nakamura, Tadahiro Kuroda, Hideharu Amano, 2013, 2013 23rd International Conference on Field programmable Logic and Applications.

Circuit and package design for 44GB/s inductive-coupling DRAM/SoC interface

Tadahiro Kuroda, Akira Okada, Yasuhiro Take, 2015, The 20th Asia and South Pacific Design Automation Conference.

3D clock distribution using vertically/horizontally-coupled resonators

Tadahiro Kuroda, Hiroki Ishikuro, Noriyuki Miura, 2013, 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers.

A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel

Tadahiro Kuroda, Junichiro Kadomoto, Yasuhiro Take, 2015, IEICE Trans. Fundam. Electron. Commun. Comput. Sci..

A vertical bubble flow network using inductive-coupling for 3-D CMPs

Daisuke Sasaki, Tadahiro Kuroda, Hideharu Amano, 2011, Proceedings of the Fifth ACM/IEEE International Symposium.

Low-latency wireless 3D NoCs via randomized shortcut chips

Radu Marculescu, Tadahiro Kuroda, Hideharu Amano, 2014, 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE).

Simultaneous 6Gb/s data and 10mW power transmission using nested clover coils for non-contact memory card

Tadahiro Kuroda, Hiroki Ishikuro, Noriyuki Miura, 2010, 2010 Symposium on VLSI Circuits.

Vertical Link On/Off Control Methods for Wireless 3-D NoCs

Tadahiro Kuroda, Hideharu Amano, Hiroki Matsutani, 2012, ARCS.

3D integration using inductive coupling and coupled resonator (Invited)

Tadahiro Kuroda, Junichiro Kadomoto, Yasuhiro Take, 2015, 2015 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).

3D NoC with Inductive-Coupling Links for Building-Block SiPs

Daisuke Sasaki, Tadahiro Kuroda, Hideharu Amano, 2014, IEEE Transactions on Computers.

An image sensor/processor 3D stacked module featuring ThruChip interfaces

Tadahiro Kuroda, Tetsuya Asai, Masayuki Ikebe, 2017, 2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC).

A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface

Hiroshi Nakamura, Tadahiro Kuroda, Hideharu Amano, 2013 .

Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network

Tadahiro Kuroda, Yasuhiro Take, 2015, IEICE Trans. Electron..

Analytical thruchip inductive coupling channel design optimization

Tadahiro Kuroda, Junichiro Kadomoto, Yasuhiro Take, 2016, 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC).

A case for wireless 3D NoCs for CMPs

Radu Marculescu, Daisuke Sasaki, Tadahiro Kuroda, 2013, 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC).

Design and analysis for ThruChip design for manufacturing (DFM)

Tadahiro Kuroda, Junichiro Kadomoto, Yasuhiro Take, 2015, The 20th Asia and South Pacific Design Automation Conference.

A 30Gb/s/link 2.2Tb/s/mm2 inductively-coupled injection-locking CDR

Tadahiro Kuroda, Noriyuki Miura, Yasuhiro Take, 2010, 2010 IEEE Asian Solid-State Circuits Conference.

A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface

Hiroshi Nakamura, Tadahiro Kuroda, Hideharu Amano, 2013, IEEE Micro.

A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface

Hiroshi Nakamura, Tadahiro Kuroda, Hideharu Amano, 2013, 2013 IEEE Hot Chips 25 Symposium (HCS).

CMA-Cube: A scalable reconfigurable accelerator with 3-D wireless inductive coupling interconnect

Hiroshi Nakamura, Tadahiro Kuroda, Hideharu Amano, 2012, 22nd International Conference on Field Programmable Logic and Applications (FPL).

Simultaneous data and power transmission using nested clover coils

Tadahiro Kuroda, Noriyuki Miura, Hayun Chung, 2012, 17th Asia and South Pacific Design Automation Conference.

[Paper] 3D Stacked Imager featuring Inductive Coupling Channels for High Speed/Low-Noise Image Transfer

Tadahiro Kuroda, Tetsuya Asai, Masayuki Ikebe, 2015 .

Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration

Tadahiro Kuroda, Masato Motomura, Yasuhiro Take, 2015, IEICE Trans. Electron..

A 352Gb/s inductive-coupling DRAM/SoC interface using overlapping coils with phase division multiplexing and ultra-thin fan-out wafer level package

Tadahiro Kuroda, Yasuhiro Take, Abdul Raziz Junaidi, 2014, 2014 Symposium on VLSI Circuits Digest of Technical Papers.

Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer

Tadahiro Kuroda, Tetsuya Asai, Masayuki Ikebe, 2015, 2015 Symposium on VLSI Circuits (VLSI Circuits).

Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces

Tadahiro Kuroda, Tetsuya Asai, Masayuki Ikebe, 2016, ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference.