Hideki Takagi

发表

Development of Three-Dimensional Integration Technology for Magnetic Random Access Memories

Kay Yakushiji, Akio Fukushima, Hitoshi Kubota, 2019 .

Effect of having floats on cardiorespiratory response during eggbeater kick

Hideki Takagi, Yosuke Sasaki, Bun Tsuji, 2015, Extreme Physiology & Medicine.

Research paperCase studies of a planar piezoresistive vibration sensor: Measuring transient time history signal waves

Ryutaro Maeda, Hideki Takagi, Yuichi Kurashima, 2016 .

疎水性単分子膜を用いたC2Wセルフアライメントと仮接合;疎水性単分子膜を用いたC2Wセルフアライメントと仮接合;C2W Self-alignment and Temporary Bonding by Using Hydrophobic Self-assembled Monolayer

Jian Lu, Ryutaro Maeda, Yuta Nakano, 2013 .

Kinematic and EMG data during underwater dolphin kick change while synchronizing with or without synchronization of kick frequency with the beat of a metronome

Hirofumi Shimojo, Hideki Takagi, Shozo Tsubakimoto, 2017, Data in brief.

Cycling Power Optimization System Using Link Models of Lower Limbs with Cleat-shaped Biaxial Load Cells

Keisuke Ishikura, Hideki Takagi, Kento Yamashita, 2014 .

High-speed Continuous Micro Pattern Fabrication on Fibers for Large-area Devices

Hiroshi Goto, Hideki Takagi, Harutaka Mekaru, 2013 .

Growth Behavior of Au Films on SiO2 Film and Direct Transfer for Smoothing Au Surfaces

Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi, 2019, Int. J. Autom. Technol..

Near Field Optical Recording on Azopolymer Using a Sub-Microsecond Pulse

Hideki Takagi, Osamu Watanabe, Wataru Mori, 2002 .

Visualization of Pedaling Technique Using Cleat-size Biaxial Load Cells☆

Keisuke Ishikura, Hideki Takagi, Kento Yamashita, 2013 .

Unsteady hydrodynamic forces acting on a robotic arm and its flow field: application to the crawl stroke.

Motomu Nakashima, Kazuo Matsuuchi, Hideki Takagi, 2014, Journal of biomechanics.

Piezoelectric MEMS devices and its application as bio-chemical sensors

Lulu Zhang, Ryutaro Maeda, Toshihiro Itoh, 2013, The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems.

Artifacts of the AFM image due to the probe controlling parameters

Hiroshi Itoh, Chunmei Wang, Hideki Takagi, 2011, Advanced Lithography.

Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection

Ryutaro Maeda, Yoichi Murakoshi, Kazuyoshi Uchino, 2001, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.

Mechanical characterization of nanowires by planar vibration sensor

Lulu Zhang, Ryutaro Maeda, Jian Lu, 2013, The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems.

Case studies of a planar piezoresistive vibration sensor

Jian Lu, Ryutaro Maeda, Hideki Takagi, 2016 .

A Sliding-press-type Reel-to-reel Thermal Imprint System for Fiber Substrates

Hiroshi Goto, Hideki Takagi, Harutaka Mekaru, 2011 .

Continuous Forming of Weaving Guides Using a Reel-to-reel Thermal Roller Imprint

Hiroshi Goto, Hideki Takagi, Harutaka Mekaru, 2012 .

Numerical and experimental investigations of human swimming motions

Motomu Nakashima, Kazuo Matsuuchi, Hideki Takagi, 2015, Journal of sports sciences.

Analytical and Experimental Study on Sensitivity of Planar Piezoresistive Vibration Sensor

Jian Lu, Ryutaro Maeda, Hideki Takagi, 2013 .

Replication of atomically smooth surface shape onto electroplated Au patterns by lift-off process and room-temperature Au–Au bonding in atmospheric air

Hideki Takagi, Yuichi Kurashima, Y. Kurashima, 2014 .

Wafer-scale spontaneous bonding of silicon wafers by argon-beam surface activation at room temperature

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 2003 .

Fully epitaxial giant magnetoresistive devices with half-metallic Heusler alloy fabricated on poly-crystalline electrode using three-dimensional integration technology

Naoya Watanabe, Kay Yakushiji, Jun Liu, 2020 .

Development and application of planar piezoresistive vibration sensor

Ryutaro Maeda, Hideki Takagi, Jian Lu, 2014 .

Size-free MEMS-IC high-efficient integration by using carrier wafer with self-assembled monolayer (SAM) fine pattern

Jian Lu, Ryutaro Maeda, Hideki Takagi, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Room-temperature direct bonding of electroplated Au patterns flattened by a thermal imprint process

Hideki Takagi, Jian Lu, Yuichi Kurashima, 2014 .

1.3 μm InGaAsP/InP lasers on GaAs substrate fabricated by the surface activated wafer bonding method at room temperature

Tadatomo Suga, Hideki Takagi, Naoe Hosoda, 1998 .

High-speed imprinting on plastic optical fibers using cylindrical mold with hybrid microstructures

Hiroshi Goto, Hideki Takagi, Harutaka Mekaru, 2013 .

Direct bonding of two crystal substrates at room temperature by Ar-beam surface activation

Ryutaro Maeda, Hideki Takagi, R. Maeda, 2006 .

Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 1998 .

A novel cavity-first process for flexible fabrication of MEMS on silicon on insulator (SOI) wafer

Ryutaro Maeda, Hideki Takagi, Jian Lu, 2014 .

Room-temperature wafer bonding of Si to LiNbO3, LiTaO3 and Gd3Ga5O12 by Ar-beam surface activation

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 2001 .

Formation of III–V-on-insulator structures on Si by direct wafer bonding

Mitsuru Takenaka, Yuki Ikku, Shinichi Takagi, 2013 .

III–V/Ge High Mobility Channel Integration of InGaAs n-Channel and Ge p-Channel Metal–Oxide–Semiconductor Field-Effect Transistors with Self-Aligned Ni-Based Metal Source/Drain Using Direct Wafer Bonding

Yoshiaki Nakano, Mitsuru Takenaka, Shinichi Takagi, 2012 .

Surface activated room-temperature bonding in Ar gas ambient for MEMS encapsulation

Hideki Takagi, Yuichi Kurashima, Y. Kurashima, 2017, 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

Transmission Electron Microscope Observations of Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 1999 .

Room-Temperature Bonding of Si Wafers to Pt Films on SiO2 or LiNbO3 Substrates Using Ar-Beam Surface Activation

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 1999 .

Thin Body III–V-Semiconductor-on-Insulator Metal–Oxide–Semiconductor Field-Effect Transistors on Si Fabricated Using Direct Wafer Bonding

Yoshiaki Nakano, Mitsuru Takenaka, Shinichi Takagi, 2009 .

Frontside-micromachined planar piezoresistive vibration sensor: Evaluating performance in the low frequency test range

Jian Lu, Ryutaro Maeda, Hideki Takagi, 2014 .

Analysis of time dependent polymer deformation based on a viscoelastic model in thermal imprint process

Ryutaro Maeda, Yasuroh Iriye, Takuya Iwasaki, 2008 .

High external quantum efficiency (10%) AlGaN-based deep-ultraviolet light-emitting diodes achieved by using highly reflective photonic crystal on p-AlGaN contact layer

Hideki Takagi, Mitsunori Kokubo, Ryuichiro Kamimura, 2017 .

Cavity-first approach for microelectromechanical system-CMOS monolithic integration

Jian Lu, Ryutaro Maeda, Hideki Takagi, 2013 .

Ultrathin Body InGaAs-on-Insulator Metal–Oxide–Semiconductor Field-Effect Transistors with InP Passivation Layers on Si Substrates Fabricated by Direct Wafer Bonding

Yoshiaki Nakano, Mitsuru Takenaka, Shinichi Takagi, 2011 .

Optimization and evaluation of the size-free integration process for MEMS-IC assembly with high yields and high efficiency

Jian Lu, Hideki Takagi, Yuichi Kurashima, 2015 .

Characterization of bonding interface prepared by room-temperature Si wafer direct bonding using the surface smoothing effect of a Ne fast atom beam

Hideki Takagi, Yuichi Kurashima, Y. Kurashima, 2014 .

(Invited) Thin Epitaxial Film of Ge and III-V Directly Bonded onto Si Substrate

Taro Itatani, J. Yugami, Toshiyuki Kikuchi, 2014 .