Tae-Gon Kim

Influence of environments on the footprint of particle contamination on EUV mask

Herbert Struyf, Marc Heyns, Stefan De Gendt, 2011, Advanced Lithography.

Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning

Ahmed Busnaina, Tae-Gon Kim, Jin-Goo Park, 2006 .

Effect of BTA on Particle Adhesion in Cu CMP

Ahmed Busnaina, In-Kwon Kim, Tae-Gon Kim, 2006 .

Collapse behavior and forces of multistack nanolines

Kurt Wostyn, Tae-Gon Kim, Jin-Goo Park, 2010, Nanotechnology.

Strength analysis of EUV-exposed photo resists by AFM at 40nm half pitch and below

Roel Gronheid, Gustaf Winroth, Tae-Gon Kim, 2012 .

The Effect of Additives in Post-Cu CMP Cleaning on Particle Adhesion and Removal

Ahmed Busnaina, Tae-Gon Kim, Jin-Goo Park, 2004 .