Kazumasa Tanida

3-Dimensional Chip Stacking for High- Density Electronic Packaging

Kenji Takahashi, Kazumasa Tanida, Mitsuo Umemoto, 2003 .

28.5 Chip Scale Camera Module (CSCM) Using Through

Hiroshi Yoshikawa, Kazumasa Tanida, Masahiro Sekiguchi, 2009 .

Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)

Kazumasa Tanida, Hiroshi Yoshikawa, Kazutaka Akiyama, 2009, 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers.

Ultra-high-density interconnection technology of 3-dimensional packaging

Kenji Takahashi, Kazumasa Tanida, Mitsuo Umemoto, 2002 .

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Kazumasa Tanida, Mitsuo Umemoto, 2003, Microelectron. Reliab..

Development of less expensive process technologies for three-dimensional chip stacking with through-vias

Kazumasa Tanida, Mitsuo Umemoto, Toshihiro Yonezawa, 2004 .

Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Yoshihiro Tomita, 2003 .

Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Yoshihiro Tomita, 2004 .

Ultra-high-density 3D chip stacking technology

Kazumasa Tanida, Mitsuo Umemoto, Yoshihiro Tomita, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..