Masakazu Ishino

3-Dimensional Chip Stacking for High- Density Electronic Packaging

Kenji Takahashi, Kazumasa Tanida, Mitsuo Umemoto, 2003 .

Trends and opportunities of system‐in‐a‐package and three‐dimensional integration

Masakazu Ishino, Manabu Bonkohara, Kenji Takahashi, 2005 .

A 3DStacked MemoryIntegrated onaLogicDevice UsingSMAFTITechnology

Yoshimi Egawa, Yoshihiro Saeki, Masakazu Ishino, 2007 .

Micro carrier for LSI chip used in the Hitachi M-800 processor group

Masakazu Ishino, Yasunori Narizuka, Inoue Tsubasa, 1991 .

Development of 3D-Packaging Process Technology for Stacked Memory Chips

Nobuaki Takahashi, Masakazu Ishino, Masaya Kawano, 2006 .

Development of Multilayer Wiring Board by Simultaneous Stacking Method of Tape Film

Masakazu Ishino, Shuji Eguchi, Mamoru Mita, 1998 .