David J. Michalak

Patterning challenges in the fabrication of 12 nm half-pitch dual damascene copper ultra low-k interconnects

Richard Schenker, Florian Gstrein, Alan Myers, 2014, Advanced Lithography.

Die Design and Fabrication for Flip-Chip-Packaged Superconducting Quantum Processors

Jeanette M. Roberts, Adel A. Elsherbini, Leonardo DiCarlo, 2018 .

Mechanical properties of high porosity low-k dielectric nano-films determined by Brillouin light scattering

Sean W. King, Ratnasingham Sooryakumar, David J. Michalak, 2013 .

Defect structure and electronic properties of SiOC:H films used for back end of line dielectrics

Patrick M. Lenahan, Sean W. King, J. Bielefeld, 2014 .