H. J. Yoo

Patterning challenges in the fabrication of 12 nm half-pitch dual damascene copper ultra low-k interconnects

Richard Schenker, Florian Gstrein, Alan Myers, 2014, Advanced Lithography.

Demonstration of an electrically functional 34 nm metal pitch interconnect in ultralow-k ILD using spacer-based pitch quartering

H. J. Yoo, M. van Veenhuizen, G. Allen, 2012, 2012 IEEE International Interconnect Technology Conference.

Resistance and electromigration performance of 6 nm wires

J. S. Clarke, M. Mayeh, M. Chandhok, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Demonstration of a 12 nm-half-pitch copper ultralow-k interconnect process

J. S. Clarke, R. Akolkar, H. J. Yoo, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.