R. Budd

MCM LGA package with optical I/O passively aligned to dual layer polymer waveguides in PCB

P. Chiniwalla, F.R. Libsch, R. Budd, 2006, 56th Electronic Components and Technology Conference 2006.

Communication technologies for exascale systems

D. M. Kuchta, B. J. Offrein, P. Pepeljugoski, 2009, OPTO.

Terabus: a chip-to-chip parallel optical interconnect

P. Chiniwalla, J. Rosner, D. Kucharski, 2005, 2005 IEEE LEOS Annual Meeting Conference Proceedings.

225 Gb/s bi-directional integrated optical PCB link

C. L. Schow, J. A. Kash, F. E. Doany, 2011, 2011 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference.