T.H. Low

Vibration fatigue analysis for FCOB solder joints

F.X. Che, J.H.L. Pang, T.H. Low, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Isothermal and thermal cycling aging on IMC growth rate in Pb-free and Pb-based solder interfaces

T.H. Low, J. Pang, T. H. Low, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Mechanical characterization in failure strength of silicon dice

D.Y.R. Chong, B.K. Lim, T.H. Low, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Modeling plated copper interconnections in a bumpless flip chip package

T.H. Low, J.H.L. Pang, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface

T.H. Low, J. Pang, T. H. Low, 2005, IEEE Transactions on Components and Packaging Technologies.