T.N. Wong

Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages

H.Y. Zhang, D. Pinjala, M.K. Iyer, 2005, IEEE Transactions on Components and Packaging Technologies.

Fluid flow and heat transfer characteristics of liquid cooled foam heat sinks

H.Y. Zhang, D. Pinjala, M.K. Iyer, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations

H.Y. Zhang, D. Pinjala, Y.K. Joshi, 2005, IEEE Transactions on Components and Packaging Technologies.

Large area spray cooling by inclined nozzles for electronic board

P.K. Chan, T.N. Wong, Z.B. Yan, 2010, 2010 12th Electronics Packaging Technology Conference.

Direct liquid cooling of a stacked MCM

D. Pinjala, V. Kripesh, Hengyun Zhang, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).