K.C. Toh

Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages

H.Y. Zhang, D. Pinjala, M.K. Iyer, 2005, IEEE Transactions on Components and Packaging Technologies.

Fluid flow and heat transfer characteristics of liquid cooled foam heat sinks

H.Y. Zhang, D. Pinjala, M.K. Iyer, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Multi-Level Approach to Thermal Modeling of Electronic Components With Numerous Fine Features

H.Y. Zhang, K.C. Toh, K.S. Tan, 2008, 2008 10th Electronics Packaging Technology Conference.