Michael Su
发表
Jeff Rearick,
Bryan Black,
Joseph Siegel,
2017,
IEEE Design & Test.
Chang-Chi Lee,
Li-Chieh Chen,
Chin-Li Kao,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Chin-Li Kao,
Yeonsung Kim,
Bryan Black,
2016,
Microelectron. Reliab..
Frank Kuechenmeister,
Michael Su,
Lei Fu,
2009,
2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Frank Kuechenmeister,
Michael Su,
Lei Fu,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
2.5D IC Micro-Bump Materials Characterization and IMCs Evolution Under Reliability Stress Conditions
Bryan Black,
Chang-Chi Lee,
Yu-Hsiang Hsiao,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).