Min Yoo

Study of interconnection process for fine pitch flip chip

Curtis Zwenger, Minjae Lee, Jaedong Kim, 2009, 2009 59th Electronic Components and Technology Conference.

Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill

Jin-Young Kim, Tae-Kyung Hwang, Joon-Yeob Lee, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Development of Instrument Transmitter Protecting Device against High-Temperature Condition during Severe Accidents

Hyun Gook Kang, Sung Min Shin, Min Yoo, 2014 .