Fabian Hopsch
发表
Andy Heinig,
Fabian Hopsch,
Robert Trieb,
2019,
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Andy Heinig,
Fabian Hopsch,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Andy Heinig,
Fabian Hopsch,
Michael Dittrich,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Andy Heinig,
Fabian Hopsch,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
Andy Heinig,
Fabian Hopsch,
2019,
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Andy Heinig,
Fabian Hopsch,
Robert Trieb,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Bernd Becker,
Ilia Polian,
Hans-Joachim Wunderlich,
2010,
2010 19th IEEE Asian Test Symposium.
Joachim Haase,
Fabian Hopsch,
Andre Lange,
2012
.
Michael Lindig,
Bernd Straube,
Fabian Hopsch,
2011,
14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems.
Fabian Hopsch,
Wolfgang Vermeiren,
Roland Jancke,
2015,
2015 IEEE 20th International Mixed-Signals Testing Workshop (IMSTW).
Erik Jan Marinissen,
Pascal Vivet,
Fabian Hopsch,
2016,
IEEE Des. Test.
Peter Schneider,
Bernd Straube,
Fabian Hopsch,
2010,
2010 IEEE International 3D Systems Integration Conference (3DIC).
Ilia Polian,
Hans-Joachim Wunderlich,
Sybille Hellebrand,
2010,
ATS 2010.
Bernd Becker,
Ilia Polian,
Hans-Joachim Wunderlich,
2010,
Asian Test Symposium.
Andy Heinig,
Fabian Hopsch,
2018,
2018 International Wafer Level Packaging Conference (IWLPC).