Sang-Ok Ha

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Sang-Su Ha, Jong-Woong Kim, Jin-Kyu Jang, 2008, Microelectron. Reliab..

Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, 2009 .

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, 2010 .

Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test

Sang-Su Ha, Sun-Kyu Park, Jong-Woong Kim, 2009 .