Shri Vishnu Kandaswamy

Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2015, Microelectron. J..

Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2013 .

Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2014 .

Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

In-Situ measurements of the relative thermal resistance: Highly sensitive method to detect crack propagation in solder joints

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).