Fosca Conti

Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2015, Microelectron. J..

Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy

Raffaella Signorini, Gordon Elger, Fosca Conti, 2019, Optics + Optoelectronics.

Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates

Raffaella Signorini, Gordon Elger, Fosca Conti, 2021, Optics + Optoelectronics.

Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates

Gordon Elger, Fosca Conti, E. Liu, 2021, Optics + Optoelectronics.

Reliability of Sintered and Soldered High Power Chip Size Packages and Flip Chip LEDs

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Evaluation of silver and copper sintering of first level interconnects for high power LEDs

Gordon Elger, Maximilian Schmid, Fosca Conti, 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC).

Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments

Raffaella Signorini, Gordon Elger, Fosca Conti, 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

In-Situ measurements of the relative thermal resistance: Highly sensitive method to detect crack propagation in solder joints

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Phase Diagram Approach to Study Acid and Water Uptake of Polybenzimidazole-Type Membranes for Fuel Cells

Werner Lehnert, Vito Di Noto, Fosca Conti, 2016 .

Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling

Raffaella Signorini, Gordon Elger, Alexander Hanss, 2018, 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Thermogravimetric investigation on the interaction of formic acid with solder joint materials

Gordon Elger, Alexander Hanss, Fosca Conti, 2016 .

Hybrid inorganic–organic proton conducting membranes based on Nafion and 5 wt% of MxOy (M = Ti, Zr, Hf, Ta and W). Part II: Relaxation phenomena and conductivity mechanism

Enrico Negro, Vito Di Noto, Fosca Conti, 2009 .

Process development and reliability of sintered high power chip size packages and flip chip LEDs

Gordon Elger, Alexander Hanss, Maximilian Schmid, 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).