Jang-Hi Im

Significance of coating stress on substrate bow in large area processing of MCM

Kwanho Yang, Jang-Hi Im, R. H. Heistand, 2001 .

High frequency/high density build-up boards with benzocyclobutene [BCB] polymer coated Cu foil

Koji Matsui, T. Shimoto, P. E. Garrou, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Physical and Mechanical Properties Determination of Photo-BCB-Based Thin Films

Jang-Hi Im, E. O. Shaffer, R. Peters, 1996 .

Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics

P. Garrou, Greg Meyers, Jang-Hi Im, 2000 .

Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-$k$ Interconnects in Flip-Chip Packages

P. S. Ho, Xuefeng Zhang, Jang-Hi Im, 2012, IEEE Transactions on Device and Materials Reliability.

Benzocyclobutene-based polymers for microelectronics

Philip E. Garrou, Jang-Hi Im, J. Im, 2001 .

Characterization of the surface structural, mechanical, and thermal properties of benzocyclobutene dielectric polymers using scanned probe microscopy

Jang-Hi Im, Ted Stokich, Gregory F. Meyers, 2001 .

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Paul S. Ho, Xuefeng Zhang, Jang-Hi Im, 2007 .

Significance of coating stress on substrate bow in large area processing of MCM

Kwanho Yang, Jang-Hi Im, R. H. Heistand, 1997, Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium.

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Andrew J. G. Strandjord, Greg Meyers, T. Stokich, 2000 .

Thermosonic Gold Wirebonding to Electrolessly-Metallized Copper Bondpads over Benzocyclobutene

Richard Ulrich, P. Garrou, Jang-Hi Im, 1999 .

Shear yielding modes of polycarbonate

Eric Baer, K. Vijayan, A. Hiltner, 1989 .