M. H. van der Veen

发表

On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control

P. Raghavan, K. Croes, P. Debacker, 2016, 2016 IEEE Symposium on VLSI Technology.

Low-Frequency Noise Measurements for Electromigration Characterization in BEOL Interconnects

M. H. van der Veen, K. Croes, I. De Wolf, 2019, 2019 IEEE International Integrated Reliability Workshop (IIRW).

Bandgap opening in oxygen plasma-treated graphene

M. H. van der Veen, G. Pourtois, M. Heyns, 2010, Nanotechnology.

Demonstration of a cost effective Cu electroless TSV metallization scheme

M. H. van der Veen, F. Inoue, S. Van Huylenbroeck, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

M. H. van der Veen, V. V. Gonzalez, C. Adelmann, 2017, 2017 IEEE International Reliability Physics Symposium (IRPS).

Three-Layer BEOL Process Integration with Supervia and Self-Aligned-Block Options for the 3 nm Node

M. H. van der Veen, J. Bekaert, K. Croes, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

Half-threshold bias Ioff reduction down to nA range of thermally and electrically stable high-performance integrated OTS selector, obtained by Se enrichment and N-doping of thin GeSe layers

L. Goux, B. Govoreanu, J. Van Houdt, 2018, 2018 IEEE Symposium on VLSI Technology.

N5 technology node dual-damascene interconnects enabled using multi patterning

S. Decoster, J. Ryckaert, K. Croes, 2017, 2017 IEEE International Interconnect Technology Conference (IITC).

Electromigration and Thermal Storage Study of Barrierless Co Vias

K. Croes, H. Zahedmanesh, O. Varela Pedreira, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

Carbon nanotube interconnects: Electrical characterization of 150 nm CNT contacts with Cu damascene top contact

M. H. van der Veen, G. Groeseneken, C. Huyghebaert, 2011, 2011 IEEE International Interconnect Technology Conference.

Switching Behavior of HfO2-Based Resistive RAM with Vertical CNT Bottom Electrode

M. H. van der Veen, D. Wouters, M. Jurczak, 2017, 2017 IEEE International Memory Workshop (IMW).

Substrate-limited Mobility in Single- and Bi-layer Graphene on Dielectric Materials

M. H. van der Veen, A. Stesmans, M. Heyns, 2009 .

Electrical and structural characterization of 150 nm CNT contacts with Cu damascene top metallization

M. H. van der Veen, C. Huyghebaert, Z. Tokei, 2012, 2012 IEEE International Interconnect Technology Conference.

Electrochemical deposition of subnanometer Ni films on TiN.

M. H. van der Veen, S. De Gendt, P. Vereecken, 2014, Langmuir : the ACS journal of surfaces and colloids.

CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/Low-k interconnects

M. H. van der Veen, K. Croes, N. Jourdan, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

K. Croes, S. Demuynck, Marleen H. van der Veen, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Electron mean-free path for CNT in vertical interconnects approaches Cu

M. H. van der Veen, Z. Tokei, Y. Barbarin, 2014, IEEE International Interconnect Technology Conference.

12-EUV Layer Surrounding Gate Transistor (SGT) for Vertical 6-T SRAM: 5-nm-class Technology for Ultra-Density Logic Devices

D. Mocuta, J. Mitard, F. Masuoka, 2019, 2019 Symposium on VLSI Technology.

Large‐area, catalyst‐free heteroepitaxy of InAs nanowires on Si by MOVPE

M. H. van der Veen, O. Richard, H. Bender, 2011 .

Synthesis and properties of an anthraquinone-based redox switch for molecular electronics.

Elisabeth H van Dijk, Daniel J T Myles, Marleen H van der Veen, 2006, Organic Letters.

Ru as an alternative material for advanced contacts

M. H. van der Veen, S. Demuynck, N. Horiguchi, 2020, 2020 IEEE International Interconnect Technology Conference (IITC).

Carbon nanotube growth from Langmuir–Blodgett deposited Fe3O4 nanocrystals

M. H. van der Veen, S. De Gendt, P. Vereecken, 2012, Nanotechnology.

Damascene Benchmark of Ru, Co and Cu in Scaled Dimensions

S. Decoster, K. Croes, I. Ciofi, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

Low Resistance Cu Vias for 24nm Pitch and Beyond

M. H. van der Veen, N. Jourdan, O. Pedreira, 2022, International Interconnect Technology Conference.

Barrier/liner stacks for scaling the Cu interconnect metallization

M. H. van der Veen, V. V. Gonzalez, K. Croes, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements

M. H. van der Veen, K. Croes, O. Pedreira, 2017, 2017 IEEE International Interconnect Technology Conference (IITC).

Electrical improvement of CNT contacts with Cu damascene top metallization

M. H. van der Veen, C. Huyghebaert, Z. Tokei, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Charge transfer effects in graphene-CdSe/ZnS quantum dots composites

Inge Asselberghs, Marc M. Heyns, Mirco Cantoro, 2012, Optics & Photonics - NanoScience + Engineering.

Electrochemical deposition of subnanometer Ni films on TiN.

M. H. van der Veen, S. De Gendt, P. Vereecken, 2014, Langmuir : the ACS journal of surfaces and colloids.

Integration of a templated directed self-assembly-based hole shrink in a short loop via chain

Roel Gronheid, Nancy Heylen, Boon Teik Chan, 2016 .