J. Bommels

On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control

P. Raghavan, K. Croes, P. Debacker, 2016, 2016 IEEE Symposium on VLSI Technology.

Low field TDDB of BEOL interconnects using >40 months of data

K. Croes, Y. Barbarin, Ph Roussel, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).

Semi-empirical interconnect resistance model for advanced technology nodes: A model apt for materials selection based upon test line resistance measurements

G. Groeseneken, R. Degraeve, D. Linten, 2016, 2016 IEEE International Reliability Physics Symposium (IRPS).

Contact module at dense gate pitch technology challenges

K. Croes, S. Demuynck, T. Kauerauf, 2014, IEEE International Interconnect Technology Conference.

New breakdown mechanism investigation: Barrier metal penetration induced soft breakdown in low-k dielectrics

I. De Wolf, K. Croes, Y. Li, 2016, 2016 IEEE International Reliability Physics Symposium (IRPS).

Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

K. Croes, S. Demuynck, Marleen H. van der Veen, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).