J. Flannery

StatPEP-current status of power electronic packaging for DC/DC and AC/DC converters

J. Flannery, P. Cheasty, M. Meinhardt, 2000, 2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018).

Power Electronics Packaging of "Low Profile" Module Integrated Converters for Photovoltaic Applications with Improved Reliability

Peter Zacharias, J. Flannery, H. Schneider, 1998 .

Benchmark of power packaging for DC/DC and AC/DC converters

J. Flannery, P. Cheasty, M. Meinhardt, 2002 .

Characterisation of cooling curves for power device die attach using a transient cooling curve measurement

J. Flannery, M. Ludwig, S.C. O'Mathuna, 2000, 2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018).

Present practice of power packaging for DC/DC converters

J. Flannery, P. Cheasty, M. Meinhardt, 2000, IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426).

Characterisation of die attach for power devices using thermal impedance measurement practice and experiment

J. Flannery, M. Ludwig, S.C. O'Mathuna, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).