Chung-Han Huang

Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch

Hao Chen, Sen-Kuei Hsu, Min-Jer Wang, 2013, 2013 IEEE International Test Conference (ITC).

A novel test module for interconnect diagnosis enhancement and quality improvement in daisy chain test

Min-Jer Wang, Hung-Chih Lin, Ching-Nen Peng, 2013, 2013 e-Manufacturing & Design Collaboration Symposium (eMDC).