Min Woo Rhee

3-D TSV Six-Die Stacking and Reliability Assessment of 20- $\mu$ m-Pitch Bumps on Large-Scale Dies

Jong Bum Lee, Jie Li Aw, Min Woo Rhee, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

3-D Modeling and Characterization for Die Attach Process

Lin Bu, Ho Siow Ling, Min Woo Rhee, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.