Michael A. Gaynes

发表

Dynamically Controlled Long Duration Operation of a Highly Energy Efficient Chiller-Less Data Center Test Facility

Roger R. Schmidt, Pritish R. Parida, Milnes P. David, 2013 .

System-Level Design for Liquid Cooled Chiller-Less Data Center

Madhusudan K. Iyengar, Roger R. Schmidt, Pritish R. Parida, 2012 .

Analysis and Evaluation Methods Associated with the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies

Timothy J. Chainer, Michael A. Gaynes, David L. Edwards, 2011 .

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Pritish R. Parida, Cornelia K. Tsang, Bing Dang, 2015 .

Effects of mechanical stress and moisture on packaging interfaces

Michael A. Gaynes, Kang-Wook Lee, Claudius Feger, 2005, IBM J. Res. Dev..

Experimental investigation of dust particle deposition in a turbulent channel flow

Goodarz Ahmadi, Michael A. Gaynes, G. Ahmadi, 1993 .

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

Pritish R. Parida, Cornelia K. Tsang, Bing Dang, 2016 .

Design and optimization of pin fin heat sinks for low velocity applications

Michael A. Gaynes, Hussain Shaukatullah, Wayne Russell Storr, 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

Experimental determination of the effect of printed circuit card conductivity on the thermal performance of surface mount electronic packages

Michael A. Gaynes, H. Shaukatullah, 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging

Michael A. Gaynes, Claudius Feger, Jae-Woong Nah, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Underfill: The Enabling Technology for Flip-Chip Packaging

Michael A. Gaynes, Daniel R. Gamota, Stephen L. Buchwalter, 2001 .

Evaluation of contact resistance for isotropic electrically conductive adhesives

Michael A. Gaynes, Judith Marie Roldan, Ravi F. Saraf, 1995 .

A non-dimensional correlation for the external thermal characteristics of surface mount metal quad flat packs

Michael A. Gaynes, H. Shaukatullah, M. Gaynes, 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).

High performance and subambient silicon microchannel cooling

Roger R. Schmidt, Evan G. Colgan, Michael A. Gaynes, 2007 .