King-Jien Chui

3D electro-optical integration based on high-performance Si photonics TSV interposer

Guo-Qiang Lo, Yan Yang, Mingbin Yu, 2016, 2016 Optical Fiber Communications Conference and Exhibition (OFC).

Heterogeneous 2.5D integration on through silicon interposer

Xiaowu Zhang, Roshan Weerasekera, Dim-Lee Kwong, 2015 .

Hot Carrier Reliability of Strained N-Mosfet with Lattice Mismatched Source/Drain Stressors

Kah-Wee Ang, King-Jien Chui, Yee-Chia Yeo, 2007, 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.

Strained Thin-Body p-MOSFET With Condensed Silicon-Germanium Source/Drain for Enhanced Drive Current Performance

Kah-Wee Ang, King-Jien Chui, Yee-Chia Yeo, 2007, IEEE Electron Device Letters.

Thin body silicon-on-insulator N-MOSFET with silicon-carbon source/drain regions for performance enhancement

Kah-Wee Ang, King-Jien Chui, Yee-Chia Yeo, 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..

Enhanced Strain Effects in 25-nm Gate-Length Thin-Body nMOSFETs With Silicon–Carbon Source/Drain and Tensile-Stress Liner

Kah-Wee Ang, King-Jien Chui, Yee-Chia Yeo, 2007, IEEE Electron Device Letters.

Lattice strain analysis of transistor structures with silicon–germanium and silicon–carbon source∕drain stressors

Kah-Wee Ang, King-Jien Chui, Yee-Chia Yeo, 2005 .

n-MOSFET With Silicon–Carbon Source/Drain for Enhancement of Carrier Transport

Kah-Wee Ang, King-Jien Chui, Yee-Chia Yeo, 2007, IEEE Transactions on Electron Devices.

Carrier Backscattering Characteristics of Strained N-MOSFET Featuring Silicon-Carbon Source/Drain Regions

Kah-Wee Ang, King-Jien Chui, Yee-Chia Yeo, 2006, 2006 European Solid-State Device Research Conference.