David V. Campbell

Yield modeling of 3D integrated wafer scale assemblies

David V. Campbell, D. V. Campbell, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Process characterization vehicles for 3D Integration

David V. Campbell, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

High-brightness, high-spatial-resolution, 6.151keV x-ray imaging of inertial confinement fusion capsule implosion and complex hydrodynamics experiments on Sandia’s Z accelerator (invited)

David V. Campbell, Michael Edward Cuneo, David Franklin Wenger, 2006 .