Mukul Joshi

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Seng Guan Chow, Roger Emigh, Raj Pendse, 2010 .

Advancements in Package-on-Package (PoP) technology, delivering performance, form factor & cost benefits in next generation Smartphone processors

Hamid Eslampour, JaeHan Chung, SeongWon Park, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.