J. Vahakangas

High performance vertical interconnections for millimeter-wave multichip modules

H. Jantunen, T. Kangasvieri, M. Komulainen, 2005, 2005 European Microwave Conference.

Cost-efficient design of 3D integrated RF and microwave modules for wireless communication systems

H. Jantunen, J. Vahakangas, T. Kangasvieri, 2004, 7th European Conference on Wireless Technology, 2004..

Broadband BGA-Via Transitions for Reliable RF/Microwave LTCC-SiP Module Packaging

M. Lahti, T. Kangasvieri, J. Vahakangas, 2008, IEEE Microwave and Wireless Components Letters.

Low-Loss and Wideband Package Transitions for Microwave and Millimeter-Wave MCMs

H. Jantunen, T. Kangasvieri, M. Komulainen, 2008, IEEE Transactions on Advanced Packaging.

Reliability testing and stress strain estimations of flip-chip joints made by stud-bump-bonding technique

J. Vahakangas, J. Vahakangas, J. Lenkkeri, 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).